Emerging 3D IC design techniques
Samta Bansal of Cadence describes new 3D IC design techniques that optimize package and die together to deliver a complete system.
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Cadence methodology architect Sharon Rosenberg talks about design trends at DAC 2011.
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20nm development will be just as challenging as the 28nm node, but double-patterning helps keep Moore's Law moving, says Suk Lee, marketing director at TSMC
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Samsung Foundry VP Ana Hunter announces her company has just qualified 28nm low power process and introduced a new flavor of 28nm that's both low power and higher performance.
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System realization methodologies are evolving quickly as hardware and software become increasingly entangled in the design process, according to Michal Siwinski,group product marketing director with Cadence.
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Cadence blogger Joe Hupcey on how engineers are now embracing (and always have) social media and how social networking is moving inside EDA tools.
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Synopsys social media guru Karen Bartleson on engineers and community and looking for the owner of a lost brain at DAC
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Cadence blogger and longtime electronics-industry journalist Richard Goering talks about the EDA industry's climb up the abstraction ladder and how he's survived 27 Design Automation Conferences
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Mentor Graphics CEO Wally Rhines on the EDA industry's outlook and why he wasn't surprised the Japan quake impact was minimal.
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EDN Editor-at-large Ron Wilson says IC devleopers are now really systems developers and that means they have to understand embedded software development, which is non-trivial.
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We surprise Magma CEO Rajeev Madhavan with a photo of an old station wagon and he uses it as a metaphor to describe the march of EDA technology.
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IBM Fellow John Cohn describes IBM's Smarter Planet initiative (instrumented, interconnected and intelligence) and how he landed on a remarkably cool reality TV show.
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GlobalFoundries R&D Fellow Luigi Capodieci describes an extension of ultra-deep submicron physical verification using pattern-matching at 28nm.
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Samta Bansal of Cadence describes new 3D IC design techniques that optimize package and die together to deliver a complete system.
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An amazing gesture-based demo from Jeff Bier of BDTI and the Embedded Vision Alliance gives a glimpse of the promise of this emerging technology.
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IC Manage CEO Dean Drako discusses the challenges of managing the biggest component of any SoC design: IP blocks
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Doug Aitelli, CEO of Calypto, discusses the company's recent new-product announcements at the 2011 Design Automation Conference
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Simon Segars from ARM discusses a new ARM community to address designers' information needs as they start SoC designs.
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Cadence's Vishal Kapoor discusses the challenges of making complex systems a reality using systems-on-chip
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EDA industry analyst Gary Smith says electronic system-level design has arrived as an accepted mainstream methodology
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Ross Teggatz, president of Triune, talks about untethered power supplies.
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Jim Hogan and Paul McLellan talk about what it takes to launch an EDA startup today
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Cadence CMO John Bruggeman offers his take on how the EDA might revitalize itself.
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Cadence EDA 360 Evangelist Steve Leibson offers tips on how to survive the long march of DAC
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Live interviews from the show floor of the 48th Design Automation Conference, June 6-9, in San Diego, Calif.
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Big Foot doesn't believe he exists! He is the most interesting man in EDA. Watch EE Times live coverage of the Design Automation Conference to see more.
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Rob Shaddock, CTO of TE Connectivity, discusses how looking beyond connectors to connectivity helps engineers tackle design challenges from broader perspective--to speed installation, reduce weight and build intelligence into systems. -
MEMS Fairy, Karen Lightman works her magic on the floor of Design West 2013.
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With the increased-use of electronics in automotive and industrial applications, the need for robust and highly reliable components is essential to ensure a proper functioning system with low maintenance costs. Automotive applications, for example h...
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Patrick Mannion of EE Times describes the making of the FitBit, a device that measures the wearer's physical exertion and wirelessly transmits and logs the data. After showing the innards, Patrick invites panelists to discuss wireless design. -
Al Steier from Munro & Associates and John Scott-Thomas of TechInsights analyze the Volt's powertrain electronics at Design West in 2012. -
Munro & Associates' Al Steier and TechInsights' John Scott-Thomas analyze the Chevy Volt's battery pack in the first of three Drive for Innovation teardown sessions.
